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WebJul 8, 2024 · Backside cracks originate in the wafer substrate and often continue across multiple die. As with any defect, the best approach is prevention. In the case of die … WebThis is because when the design rule becomes smaller, a smaller particle can contribute to yield loss. For a 16M DRAM chip, the design rule is 0.5 µm, the chip size is 1.4 cm², and the killing defect size is 0.18 µm. Due to contamination that occurs in a cleanroom, the wafer defect density measured at size 0.3 um increases. If a 125 mm ... greeley used car dealership
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