WebThe TSSOP (Thin-Shrink Small Outline Package) package has a package width of less than 300 mils and an overall height of less than 1.2 mm. DIP package VS SOP package. Both DIP and SOP belong to package types with two terminal directions. The package methods of Small Outline Package and Small Outline J-leaded series are basically similar to DIP. Webplastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body 3. Soldering 0.6 (6x) 0.5 (6x) Footprint information for reflow soldering of SOT1202 package SOT1202 so t 1 2 0 2 _ f r occupied area solder resist Issue date Dimensions in mm 10-09-10 14-01-06 solder paste = solder lands 0.7 1.4
TSOP - Thin Small Outline Package
WebTexas Instruments (TI) always has been a leader in IC packaging and is now introducing a new family of thin very small-outline packages (TVSOP) to support the component … Web5 rows · Thin Small Outline Packages (TSOP) are thin body size components; thickness is 1.0mm. TSOP ... periphery\u0027s f2
TSSOP10 (SOT552-1) Nexperia
WebPACKAGE MATERIALS SET A= P b (Note 1) eeF=rf P-b PACKAGE TYPE T = 56-pin Thin Small Outline Package (TSOP) Standard Pinout(TSO56) F = 64-ball Fortified Ball Grid Array, 1.0 mm pitch package (LAA064) SPEED OPTION 90 = 90 ns 10 = 100 ns 11 = 110 ns 12 = 120 ns 13 = 130 ns DEVICE NUMBER/DESCRIPTION S29GL01GP, S29GL512P, … WebThe CD40257B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT and NSR suffixes), and 16-lead thin shrink small-outline packages (PW … WebSemiconductor Packages There are many types of semiconductor packages, varying according to their intended use. There are JEDEC and JEITA standards for semiconductor packages, but there are many packages from different semiconductor manufacturers that are not classified by these standards. periphery\\u0027s f9